Technology Crossover - HiTEC

IMPORTANT EVENT NOTICE: 
HiTEC 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an abstract submission deadline now extended to JANUARY 13, 2021. Corporate partnership opportunities will be shared soon. Click here to learn more about this change.


HiTEC Sponsor:

 

 

General Co-Chairs:
F. Patrick McCluskey, University of Maryland 
mcclupa@calce.umd.edu

Colin Johnston, Oxford University 
colin.johnston@materials.ox.ac.uk

Organizing Committee:
Liangyu Chen, OAI/NASA GRC
Holger Kappert, Fraunhofer IMS
Callum Middleton, CSA Catapult
Randy Normann, Perma Works


SUBMIT ABSTRACTS
LAST CALL FOR ABSTRACTS -- NOW DUE: JANUARY 13, 2021

HiTEC 2021 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2021 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.




HiTEC 2021 Conference Program

SUBMIT ABSTRACTS
Last Call For Abstracts -- Now Due: JANUARY 13, 2021

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital

- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

Speaker Deadlines & Information:

  • Abstracts Final Deadline: JANUARY 13, 2021
  • Speaker Notification Emails: January 20, 2021
  • Final Paper & Copyright Form for HiTEC Proceedings Due: March 15, 2021
    • PAPER TEMPLATE (WORD | right click SAVE TARGET AS to save to your computer) - recommended layout and formatting for your paper submission
    • COPYRIGHT TRANSFER FORM (PDF | right click SAVE TARGET AS to save to your computer
  • Early Registration Deadline: March 2021
  • Technical Presentation Time: 30 minutes (PRE-RECORDED / ON-DEMAND PRESENTATIONS)
    • Pre-recorded presentation file, bio, and photo must be uploaded on/before MARCH 24, 2021
    • Pre-record using powerpoint or other tools (zoom or webex) - create a .MP4 or .MOV file (details soon)
    • Slide one of your powerpoint should be your photo and bio and make a self-introduction to start your presentation recording.
  • LIVE Keynote Speaker Presentation Time: 45 minutes (40 to present; 5 for Q&A)


Presentation Format & Details:

  • IMAPS does not require you to use a conference powerpoint template. You are able to use your regular company/preferred powerpoint templates.
  • Please include the IMAPS show name and dates on your template and/or an IMAPS logo.
  • Poster Session/Information (if applicable): The poster session is planned to be an INTERACTIVE presentation. More information about the virtual delivery of a poster session will be provided as soon as it is available.
  • Dress Code: There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.
  • All session presentations are 25 minutes followed by 5 minutes for Questions
  • Speak with your session chair if you need assistance.
  • Photography and screenshots are not permitted.