Technology Crossover - HiTEC

Update: This event has been rescheduled for April 20-22, 2021.


Due to the continually evolving conditions surrounding COVID-19, the technology crossover extravaganza featuring the international conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and Power Packaging has been postponed to April 20-22, 2021.

Speakers, sponsors, exhibitors and attendees will be contacted with relevant details about refunds and/or credits immediately. 

Please contact info@imaps.org if you have any questions about this event.

HiTEC Sponsor:

 

 

General Co-Chairs:
F. Patrick McCluskey, University of Maryland 
mcclupa@calce.umd.edu

Colin Johnston, Oxford University 
colin.johnston@materials.ox.ac.uk

Organizing Committee:
Liangyu Chen, OAI/NASA GRC
Holger Kappert, Fraunhofer IMS
Randy Normann, Perma Works

SUBMIT ABSTRACTS

HiTEC, CICMT,  Power Packaging -- Rescheduled to April 2021!
ABSTRACTS DUE: OCTOBER 31, 2020


HiTEC 2020 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2020 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.



HiTEC 2020 Conference Program

SUBMIT ABSTRACTS

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital

- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

Speaker Deadlines & Information:

  • Abstracts Deadline: October 31, 2020
  • Speaker Notification Emails: November 18, 2020
  • Final Paper & Copyright Form for HiTEC Proceedings Due: March 15, 2021
    • PAPER TEMPLATE (WORD | right click SAVE TARGET AS to save to your computer) - recommended layout and formatting for your paper submission
    • COPYRIGHT TRANSFER FORM (PDF | right click SAVE TARGET AS to save to your computer
  • Hotel Reservation Deadline: March 2021
  • Early Registration Deadline: March 2021
  • Speaker Bios Due: April 1, 2021
  • Powerpoint/Presentation file for DOWNLOAD due not later than: April 22, 2021 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB. Arrive at least ONE HOUR prior to your session start. Recommended to have back-up in the cloud, on personal laptop which you bring with you to the conference, and/or email to bschieman@imaps.org prior to the day of your presentation.
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Speaker Presentation Time: 45 minutes (40 to present; 5 for Q&A)


Presentation Format & Details:

  • IMAPS does not require you to use a conference powerpoint template. You are able to use your regular company/preferred powerpoint templates.
  • Please include the IMAPS show name and dates on your template and/or an IMAPS logo.
  • Poster Session/Information (if applicable): The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interruption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM: (TBD).
  • Dress Code: There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.
  • Session rooms will be equipped with: Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.
  • All session presentations are 25 minutes followed by 5 minutes for Questions
  • You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
  • Speak with your session chair if you need assistance.
  • About the Session: Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).
  • Photography is not permitted in the session rooms.
  • Silence all mobile phones during session attendance!