Device Packaging (March)

Amkor logo
JCET logo
SemiDice logo
Dupont logo
Namics logo
Mentor Logo
Cadence logo


The largest 2020 conference dedicated to

3D Integration 

Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications (new!)



Conference and Technical Workshops
March 3-5, 2020
Exhibition and Technology Showcase
March 3-4, 2020
Professional Development Courses
March 2, 2020
GBC Plenary Session
March 4, 2020

General Chair:

General Chair-elect:Past General Chairs:

Rama Puligadda,  Brewer Science

Eric Huenger, DuPont Electronic & Imaging

Jon Aday, Illumina, Inc.  (2019)
Peter Ramm, Fraunhofer EMFT  (2018)

3D Integration Track Chairs:

Flip Chip, Wafer Level Packaging &
Fan-Out Track Chairs:

Advanced Pkg & Emerging Materials for
Automotive, 5G & Next Gen Apps Track Chairs
Lars Boettcher, Fraunhofer IZM Curtis Zwenger, Amkor TechnologyPrasad Dhond, Amkor Technology
Mike Kelly, Amkor TechnologyNokibul Islam, JCET GroupTu-Anh Tran, NXP Semiconductors
Marco Delsarto, STMicroelectronics Beth Keser, Intel


 

2020 Conference Overview:

The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

 


 

Health Preparedness Statement for DPC 2020

Notice Regarding the Novel Corona Virus

IMAPS is consulting government agencies, event partners, and our stakeholders regarding the novel corona virus ahead of the International Conference and Exhibition on Device Packaging. We will keep attendees informed of any effects to the conference. IMAPS remains committed to delivering the best device packaging conference this spring and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors.

Read the full statement here...

 



Keynote Speakers

Announcing the Device Packaging 2020 keynote speakers. 

Dr. Christian Hoffman

Principal Engineer, Qualcomm Germany RFFE GMbH

SeungWook "SW" Yoon

Corporate Vice President, Samsung Electronics

Dr. Wolfgang Sauter

Customer Engineer Solutions - Packaging, Marvell Semiconductor

Douglas Yu
Vice President R&D, TSMC


Global Business Council Keynote & Plenary Session

on Electronics Industry Transition 

Featuring presentations from:

Vaibhav Trivedi, Sr.
Yole Development
Andrea Lati
VLSI Research
E. Jan Vardaman
TechSearch International
Yin Chang
ASE Group
Subu Iyer
UCLA

Technical Tracks

The DPC 2020 technical program features over 60 speakers in three tracks. Tracks and sessions include...

3D Integration
  • Application & Design
  • Technology - Organic & Silicon Based 3D
  • Technology - 3D Silicon and Glass
  • Bonding and Metrology
Fan-Out, Wafer Level Packaging & Flip Chip
 
  • Challenges in FOWLP
  • Advances in Process, Materials, and Equipment for FOWLP
  • Packaging Advances in High Performance Compute
  • Novel Concepts in Fan-Out & Wafer Level Packaging
Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications
1
  • Automotive Packaging Trends
  • Automotive and 5G SiPs
  • Next Gen Application Solutions
  • Next Gen Applications

Plus an outdoor poster session and happy hour!


Other Highlights

High Performance Computing: Are Chiplets the Answer?

A panel discussion moderated by Jan Vardaman of TechSearch International and Beth Keser of Intel Corporation

Featuring panelists from TSMC, Samsung, Micrososft, Intel, NHanced Semiconductors, and zGlue!


Professional Development Courses

DPC 2020 organizers are proud to offer NINE professional development courses to supplement the conference technical program. These short, two-hour classroom-style courses taught by industry heavyweights are offered prior to the start of the conference program on Monday, March 2nd. 
MONDAY, MARCH 2, 2020
MORNING COURSES
10:00AM-12:00PM     
PDC 1:  CANCELLED
Introduction to Fan Out Packaging
Course Leader: John Hunt, ASE Group
PDC 2:
System-in-Package (SiP) System Solutions Through Miniaturization
Course Leader: Mark Gerber, ASE Group
PDC 3:
Basics of Conventional and Advanced Chip Packaging
Course Leader: Syed Sajid Ahmad, CrossFire Tech
EARLY AFTERNOON COURSES
1:00PM-3:00PM
PDC 4:
Development of Advanced Fan Out Technologies
Course Leader: John Hunt, ASE Group
PDC 5:
3D Package Assembly and Technology for Mobile Devices
Course Leader: Tom Dory, Fujifilm Electronic Materials
PDC 6:
Gold-Aluminum Intermetallics
Course Leader: Syed Sajid Ahmad, CrossFire Tech
PDC 7:
Fundamentals of 5G
Course Leader: Ivan Ndip, Fraunhofer IZM
LATE AFTERNOON COURSES
3:30PM-5:30PM
PDC 8:
Advances in Fan-Out Wafer Level Packaging (FOWLP)
Course Leader: Beth Keser, Intel Corporation
PDC 9:
The Evolution of Flip Chip Package Technology
Course Leader: Mark Gerber, ASE Group
PDC 10:
Polymers in Wafer Level Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC
PDC 11:  CANCELLED
Wafer Level Fan Out in Advanced Packaging Assembly and Technology
Course Leader: Tom Dory, Fujifilm Electronic Materials
PDCs are add-on supplements to conference registrations or as stand-alone educational opportunities. Click here to learn more about our course offerings and register!

Technology Showcase

Another year, another SOLD OUT exhibit hall! Connect with exhibitors who are offering the solutions for your device packaging needs March 3rd-4th. DPC 2020 will welcome these fine industry sponsors and exhibitors. 

A.L.M.T. Corp

AdTech Ceramics

AI Technology, Inc.

Akrometrix

Amkor Technology, Inc.

ASE Group

ASMP Technology

Axus Technology

Besi North America, Inc.

BSET EQ

Cactus Materials, Inc.

Cadence

DeWeyl Tool Company, Inc.

DuPont Electronics & Imaging

EMD Performance Materials

EV Group

Evatec

F&K Delvotec

Finetech

Golden Altos Corporation

Huatian Technology Group

IBM Canada Ltd

Integra Technologies, LLC

JCET Group

JSR Micro

Kayaku Advanced Materials

Kulicke and Soffa Industries

Kyocera International Inc.

LINTEC OF AMERICA, INC.

MacDermid Alpha Electronics Solutions

Materion

Mentor, A Siemens Business

Metalor

Micro Systems Technologies, Inc.

Micross

Mini-Systems, Inc.

NAMICS Corporation

Neutronix Quintel (NXQ)

Nordson SONOSCAN

NTK Technologies, Inc.

Oneida Research Services, Inc.

Onto Innovation (formerly Rudolph Technologies)

PacTech USA Packaging Technologies, Inc.

Palomar Technologies

PLASMA-THERM

Practical Components Inc.

Quik-Pak

SemiDice, Inc.

SETNA Corporation

Sikama International, Inc.

SPTS Technologies Ltd, A KLA Company

StratEdge Corporation

SUSS MicroTec, Inc.

Technic

TechSearch International, Inc.

Teikoku Taping System Inc

Towa USA Corp.

Unisem

Xperi Corporation

XYZTEC

Yole Developpement

Zuken, Inc.

Zymet, Inc.

Access to the exhibit hall is included in all conference registrations. Not attending the conference but need to make a connection or find a solution with our exhibitors? Exhibits visitor badges are FREE. Click here for more information.

Sponsors

Platinum Sponsor

Gold Sponsors
Amkor logo
JCET logo
SemiDice logo

Silver Sponsors

Dupont logo
Namics logo
Mentor Logo
Cadence logo

Corporate Sponsors

Event Sponsors

Break Sponsor: Spectrum Semiconductor Materials

Media Sponsors